Standard Offline AI Automated Optical Inspection · 15μm / 5MP
The T3PRO offline ai aoi optical inspection equipment serves SMT manufacturing environments with diverse, low-volume PCB assembly runs. It is designed to detect defects in soldered printed circuit board assemblies offline, after processes such as solder paste application, red glue, and wave soldering. Its AI-driven system simplifies programming by requiring only one good-quality board, eliminating the need for CAD data, which reduces changeover time and streamlines inspection for varied products.
This system features a detection resolution of 15m using a high-speed 5MP industrial camera combined with multi-spectrum RGB lighting and a parallax-free dual telecentric lens. The AI improves accuracy continuously, lowering false alarms substantially. Operating locally for data security, it supports voice control for hands-free operation. The platform accommodates PCB sizes from 50mm to 330mm and includes automatic clamping and precise positioning, suitable for SMT quality control requirements.
The equipment is applicable in factories requiring reliable offline quality inspection of PCB assemblies at small or medium batch scales, with rapid AI programming to support frequent product changes. Its intuitive interface enables operator training within 30 minutes, facilitating adoption in production lines without extensive technical expertise. The system assists businesses in securing product quality post-soldering, improving defect detection accuracy while maintaining data security on-site.
| Item | Specification |
|---|---|
| Model | IrisAnt T3 Pro |
| Product Type | Offline 2D PCBA AOI System |
| Detection Resolution | 15μm |
| Camera | 5MP (5 Megapixel) |
| Item | Specification |
|---|---|
| Camera | 5MP High-Speed Industrial Camera |
| Resolution | 15μm |
| Light Source | Multi-Spectrum Ultra-High-Speed RGB 6-Channel Lighting |
| Lens | Dual Telecentric Lens (parallax-free, effectively avoids reflection interference) |
| Inspection Speed | 0.238 sec/FOV |
| Item | Specification |
|---|---|
| PCB Size | 50×50mm ~ 470×330mm |
| PCB Thickness | 0.5mm ~ 5mm |
| Max PCB Warpage | Top 25mm / Bottom 10mm |
| PCB in Process | ±3mm |
| Max PCB Thickness | 2.5mm |
| Item | Specification |
|---|---|
| X/Y Platform Repeat Positioning Accuracy | ±0.01mm |
| Platform Movement Speed | 900mm/s |
| PCB Clamping | Automatic Clamping |
| Power Supply & Consumption | AC 220V 50/60Hz / 1KW |
| Drive System | Panasonic AC Servo Motor + Ground Ball Screw |
| Graphics Card | Nvidia 3060 12GB |
| Operating System | Windows 10 Enterprise |
| CPU | i5-12600 16-Thread |
| Memory | 64GB |
| Monitor | 23.8" LCD |
| Machine Dimensions (L×W×H) | 860 × 1040 × 1318 mm |
| Machine Weight | 345 KG |
| Category | Inspection Items |
|---|---|
| Component Inspection | Missing, reversed, offset, polarity, wrong component, damage, bent leads, foreign objects, pad contamination, excess glue, and entire-board foreign component detection |
| Solder Joint Inspection | Excessive/insufficient solder, side-standing, solder bridging, tombstoning, insufficient wetting, lifted leads, solder balls, and wave-soldering joint inspection (including DIP) |
| Special Applications | Solder paste process, adhesive process, and post-wave-soldering PCBA inspection; optional 3D height measurement (component height, lifted lead / insufficient wetting) |
| Item | Specification |
|---|---|
| Inspection Algorithm | AI Embodied Spatial Intelligence Algorithm, Feature Vector Analysis, OCV/OCR for Silk Screen |
| Programming Modes | AI Smart Programming, CAD Coordinate Import, Auto Component Library Indexing, Smart Panel Recognition |
| Marking Functions | PCB Full-Board Mark, Panel Mark, Bad Board Mark |
| Multi-Angle Inspection | 0~360°, Accuracy = 1 |
| Human-Machine Interaction | Voice Command Control |
| Reporting | Automated SPC Statistical Analysis & Data Reports |
| Remote Control | Offline Programming, Remote Real-Time Debugging, Remote Viewing / Remote Operation Control |
The T3PRO offers a high level of inspection precision aligned with industry requirements, with specifications suited for various PCB sizes and thicknesses. Its AI-driven programming process minimizes setup time and reliance on CAD files, which may simplify integration into existing production workflows. Local data deployment enhances compliance with data security policies, which can be a procurement consideration when selecting offline ai aoi optical inspection equipment.
This equipment is designed to accommodate small-batch and multi-variant SMT lines through fast programming and changeover. Voice-controlled inspection capabilities reduce operator workload and allow hands-free operation, potentially improving efficiency in the workplace. The machine's user-friendly nature, with short operator training time, supports scenarios involving quick transitions or workforce training. Its characteristics support procurement for manufacturers seeking offline inspection options without network dependency.
Consumer Electronics, Automotive Electronics, Industrial Control, Medical Electronics, Telecommunications, Aerospace & Defense, EMS Contract Manufacturing
— Shenzhen IrisAnt Intelligent Technology Co., Ltd —