• T9 3D Onlinehigh-speed  AI AOI single track Inspection Machine for SMT Line,IRIS ANT,T9 3D Onlinehigh-speed  AI AOI single track Inspection Machine for SMT Line
  • T9 3D Onlinehigh-speed  AI AOI single track Inspection Machine for SMT Line,IRIS ANT,T9 3D Onlinehigh-speed  AI AOI single track Inspection Machine for SMT Line

T9 3D Online high-speed AI AOI single track Inspection Machine for SMT Line

No.3D T9 single track AI AOI
The IrisAnt T9 is an inline 3D AOI featuring 4-directional projection units and a 26MP camera, delivering ±2μm-precision 3D height measurement to accurately detect lifted leads, insufficient wetting, and other defects challenging for 2D AOI. With just one good reference board, AI completes programming in 5 minutes and reduces false calls by 80% — ideal for high-reliability inline inspection in automotive electronics and similar industries.
1. Key Selling Points
  • - “True 3D Inspection”: Equipped with 4-directional Scheimpflug projection units and a 26MP high-speed camera, simultaneously performs 2D defect recognition and ±2μm-precision 3D height measurement. Accurately detects solder wetting height, lifted leads, insufficient wetting, and other defects that 2D AOI cannot capture.
  • - “5-Minute AI Programming”: No CAD files required – just one good reference board. AI automatically completes programming, slashing changeover time from the traditional 3~5 hours.
  • - “80% False Call Reduction”: Continuously learns from operator feedback, becoming more accurate over time.
  • - “One-Box Multi-Test”: A single inspection frame simultaneously detects missing, wrong, reversed, damaged components, and tombstoning.
  • - “Fully Local Deployment”: Data never leaves the factory, ensuring core process secrets remain absolutely secure.

2. Application Scenarios
  • - Inline fully automated 3D inspection of component placement and soldering quality on SMT production lines.
  • - Precise judgment of challenging soldering defects such as lifted leads, insufficient wetting, and solder wetting height/volume ratio.
  • - Seamless integration into single-lane automated production lines for 24/7 real-time inspection.

3. Target Industries
  • - Automotive Electronics, Medical Electronics, Aerospace & Defense (where soldering reliability is critical).
  • - Consumer Electronics, Telecommunications Equipment, and EMS Contract Manufacturers (high-density precision manufacturing).

4. Purchasing Considerations
  • - “Model Selection”: Choose T9 for single-lane lines; choose T9D for dual-lane high-capacity requirements.
  • - “PCB Specifications”: Confirm PCB size (≤300mm width in dual-lane mode), thickness (0.6~5mm), and minimum component size (0603/0201) meet your requirements.
  • -“ Facility Requirements”: Machine dimensions 1290×1710×1990mm, weight approx. 1000kg, power 8.8KW – confirm space and power capacity.
  • - “Optional Features”: Barcode scanning, MES traceability interfaces, and other options should be specified in advance.
  • - “3D Necessity Assessment”: If your production line's primary defects are height-related issues (insufficient wetting, lifted leads, poor solder wetting), 3D AOI is a more thorough solution than 2D AOI.
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  • T9 3D Onlinehigh-speed  AI AOI single track Inspection Machine for SMT Line,IRIS ANT,T9 3D Onlinehigh-speed  AI AOI single track Inspection Machine for SMT Line

Description

IrisAnt T9 Inline 3D AOI

AI-Powered Inline 3D Automated Optical Inspection · ±2μm Height Accuracy

Product Description

Functional Positioning for SMT Quality Control

The T9 3D digital high-speed AI AOI single track Inspection Machine is designed for real-time component and soldering quality inspection in surface-mount technology (SMT) production lines. It targets manufacturers and suppliers needing automated, inline inspection of PCBA assemblies to detect missing, misaligned, or solder-related defects, enabling process monitoring and quality assurance during assembly.

Technical Specifications Supporting Inspection Accuracy

Equipped with a 26MP high-speed camera and four-directional Scheimpflug projection units, the system provides synchronized 2D and 3D inspection with ±2μm height accuracy. Its AI-driven programming requires only a single reference board for setup within five minutes without CAD files. The unit supports PCB sizes up to 500×325mm and offers high throughput inspection speeds suitable for single-lane SMT lines.

Application Fit in Automated SMT Assembly

This single-track inspection equipment integrates with existing SMT lines for continuous defect detection, including lifted leads, insufficient wetting, and component errors. The local data deployment maintains process confidentiality and supports scenarios requiring immediate feedback. Its compact footprint and zero-threshold operation facilitate operational adoption in production environments with changeover frequency considerations.

📌 One-Line Positioning: The IrisAnt T9 is an inline 3D AOI that delivers true 3D height measurement with ±2μm precision, capturing lifted leads, insufficient wetting, and other defects that 2D AOI cannot detect — all with 5-minute AI programming and 80% false call reduction.

I. Key Selling Points

📐 True 3D Inspection
4-directional Scheimpflug projection units + 26MP camera deliver ±2μm precision height measurement
5-Minute AI Programming
No CAD files — just one good board. Changeover slashed from 3~5 hours to 5 minutes
📉 80% False Call Reduction
Continuous learning from operator feedback — gets more accurate over time
📦 One-Box Multi-Test
Single frame detects missing, wrong, reversed, damaged components, and tombstoning
🔒 Fully Local Deployment
Data never leaves the factory — core process secrets remain absolutely secure
👆 Zero-Threshold Operation
Operators master it in 30 minutes — no professional AOI engineer required

II. Technical Specifications

Model Overview

Item Specification
Model IrisAnt T9
Product Type Inline 3D PCBA AOI System
Inspection Type 2D + 3D Synchronized Inspection
Height Accuracy ±2μm (with calibration tool)

Vision System

Item Specification
Camera 26MP High-Speed Industrial Camera
3D Technology 4-Directional Scheimpflug Projection Units
FOV (Field of View) 60mm × 60mm
Optical Resolution 14μm
Inspection Speed >10 cm²/s
Max Height Measurement Range 25mm

PCB Handling Capability

Item Specification
Rail Type Single Rail
Rail Height 900±20mm
PCB Size 50×50mm ~ 500×325mm (customizable for larger sizes)
PCB Thickness 0.6mm ~ 5mm
Component Height Clearance Top 50mm / Bottom 40mm
Minimum Component Size 0603 (mm) / 0201 (inch)

Hardware Configuration

Item Specification
PCB Flow Direction Left to Right, Right to Left (customizable)
Drive System & Positioning Accuracy AC Servo Motors / ±0.01mm
Motherboard ASUS B850-Plus
CPU AMD Ryzen 9 7900X
Memory Kingston DDR5 5600 64GB
Storage WD 512GB SSD + WD 2TB HDD
Graphics Card Nvidia 4070 12GB
Power Supply AC 220V ±10%, 50/60Hz, 8.8KW
Air Supply 4~6 Bar
Machine Dimensions (L×W×H) 1290 × 1710 × 1990 mm (excluding signal tower)
Machine Weight Approx. 1000kg

Inspection Capabilities

Category Inspection Items
Component Inspection Missing, tombstoning, side-standing, polarity, misalignment, wrong component, damage, flipped, lifted leads, foreign objects, floating, silk screen defects
Solder Joint Inspection Solder wetting height, solder volume %, excessive solder, insufficient solder, bridging, lifted leads, surface scratches / contamination on gold fingers
Special Applications Solder paste process, adhesive process, and post-wave-soldering PCBA inspection; 3D component height measurement, lifted lead / insufficient wetting height detection

Software System

Item Specification
Inspection Algorithm AI Embodied Spatial Intelligence, Feature Vector Analysis, OCV/OCR for Silk Screen
Programming Modes AI Smart Programming, CAD Coordinate Import, Auto Component Library Indexing, Smart Panel Recognition
Marking Functions PCB Full-Board Mark, Panel Mark, Bad Board Mark
Multi-Angle Inspection 0~360°, Accuracy = 1
Remote Control Offline Programming, Remote Real-Time Debugging, Remote Viewing / Remote Operation Control
MES Integration Open API for seamless MES/ERP connectivity
SPC Reporting Automated Statistical Process Control & Data Reports

 Product Advantages

Procurement-Relevant Design and Customization

The T9's PCB size range and component height clearance accommodate varied SMT products, making it suitable for OEM/ODM sourcing and assembly providers managing diverse boards. Its AI programming accelerates setup times, and local data security aligns with proprietary process requirements. Packaging and delivery details are subject to buyer inquiry.

Operational Fit and Data Security Considerations

Designed for single-track inline inspection, the system supports continuous operation in high-throughput SMT lines. The zero-threshold operation enables faster operator training. Localized data handling ensures that inspection data remains within client-controlled environments, supporting businesses concerned with intellectual property protection in optical inspection equipment procurement.

III. Application Scenarios

  • ✅ Inline fully automated 3D inspection of component placement and soldering quality on SMT production lines
  • ✅ Precise judgment of challenging soldering defects — lifted leads, insufficient wetting, solder wetting height/volume ratio
  • ✅ Seamless integration into single-lane automated production lines for 24/7 real-time inspection

IV. Target Industries

Automotive Electronics, Medical Electronics, Aerospace & Defense (high-reliability requirements) — Consumer Electronics, Telecommunications Equipment, EMS Contract Manufacturers (high-density precision manufacturing)

V. Purchasing Considerations

  • Model Selection: Choose T9 for single-lane lines; choose T9D for dual-lane high-capacity requirements
  • PCB Specifications: Confirm PCB size (≤500×325mm, customizable), thickness (0.6~5mm), and minimum component size (0603/0201 standard)
  • Facility Requirements: Confirm floor space (1290×1710×1990mm), weight capacity (1000kg), power (8.8KW), and air supply (4~6Bar)
  • 3D Necessity Assessment: If your production line's primary defects are height-related (insufficient wetting, lifted leads, poor solder wetting), 3D AOI is a more thorough solution than 2D AOI
  • Optional Features: Barcode scanning, MES traceability interfaces, and other options should be specified in advance
  • Software & Support: Verify that AI programming, remote operation, and SPC reporting are fully included; ensure permanent free software upgrades are contractually stated
💡 Model Selection Tip: For dual-lane high-capacity production, refer to the T9D model; T9 is the ideal choice for single-lane inline full inspection with demanding 3D height measurement requirements.

— Shenzhen IrisAnt Intelligent Technology Co., Ltd —

FAQ

How quickly can the T9 3D digital high-speed AI AOI be set up for a new PCB model?
We complete AI programming on the T9 machine in just 5 minutes using one good reference board, requiring no CAD files. This fast setup minimizes downtime, supporting high-efficiency SMT production with our digital high-speed AI AOI system.

Can the T9 AOI system accommodate different PCB sizes and thicknesses?
Yes, our T9 inspection machine supports PCBs ranging from 50×50mm up to 500×325mm in size and thicknesses between 0.6mm and 5mm. This versatility ensures precise inline inspection for a wide range of SMT production requirements.

Is the T9 Inspection Machine compatible with existing single-lane SMT lines?
We designed the T9 specifically for seamless integration into single-track SMT lines. It performs real-time, fully automated inspection with reliable defect detection, making it suitable for continuous 24/7 operation within your production workflow.

What measures does the T9 use to ensure data security during inspections?
Our system deploys all inspection data fully locally, safeguarding your proprietary process information. By operating on secure local data deployment, the T9 offers high-speed defect identification while maintaining confidentiality crucial to your SMT line.

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