1. Key Selling Points
Dual-Lane High-Capacity Design: Dual-lane parallel design with Lane 1 & 4 fixed, Lane 2 & 3 auto-adjustable — supports simultaneous dual-board inspection, maximizing throughput for high-volume production environments.
True 3D Inspection: Equipped with 4-directional Scheimpflug projection units and a 26MP high-speed camera, simultaneously performs 2D defect recognition and ±2μm-precision 3D height measurement — accurately detects lifted leads, insufficient wetting, and other defects that 2D AOI cannot capture.
5-Minute AI Programming: No CAD files required — just one good reference board. AI automatically completes programming, slashing changeover time from the traditional 3~5 hours.
80% False Call Reduction: Continuously learns from operator feedback, becoming more accurate over time.
Fully Local Deployment: Data never leaves the factory, ensuring core process secrets remain absolutely secure.
2. Application Scenarios
Inline fully automated 3D inspection on dual-lane SMT production lines for component placement and soldering quality.
Precise judgment of challenging soldering defects such as lifted leads, insufficient wetting, and solder wetting height/volume ratio.
Dual-lane parallel inspection enables 24/7 high-throughput real-time inspection.
3. Target Industries
Automotive Electronics, Medical Electronics, Aerospace & Defense (where soldering reliability is critical).
Consumer Electronics, Telecommunications Equipment, and EMS Contract Manufacturers (high-density precision manufacturing, high-volume production).
4. Purchasing Considerations
Model Selection: Choose T9D for dual-lane high-capacity requirements; choose T9 for single-lane lines.
PCB Specifications: Confirm PCB size in dual-lane mode (width ≤ 300mm), thickness (0.6~5mm), and minimum component size (0603/0201) meet your requirements.
Facility Requirements: Machine dimensions 1290×1710×1990mm, weight approx. 1000kg, power 8.8KW — confirm space and power capacity.
Optional Features: Barcode scanning, MES traceability interfaces, and other options should be specified in advance.
3D Necessity Assessment: If your production line's primary defects are height-related issues (insufficient wetting, lifted leads, poor solder wetting), 3D AOI is a more thorough solution than 2D AOI.
High-Capacity Dual-Lane AI 3D Automated Optical Inspection · ±2μm Height Accuracy
The T9D 3D digital high-speed AI AOI optical inspection equipment is designed for high-volume SMT production lines requiring inline inspection of printed circuit boards. It targets manufacturers and integrators who need to detect complex surface-mount defects rapidly and accurately, supporting production environments that demand simultaneous inspection of multiple boards to optimize throughput.
This dual-track inspection system employs 3D measurement with ±2μm height accuracy using four-directional Scheimpflug projection units and a 26MP high-speed camera. It identifies defects such as lifted leads and insufficient solder wetting that are challenging for traditional 2D systems. AI programming requires only one reference PCB and completes within approximately five minutes, reducing changeover time. Its local data processing ensures factory data confidentiality.
The equipment fits inline SMT assembly lines with dual-lane PCB handling, suitable for board sizes from 50×50mm to 500×300mm and component heights up to 50mm. It assists in real-time defect detection and classification, supporting quality assurance workflows where minimizing false calls and downtime is critical. The system is appropriate for production setups aiming to maintain consistent soldering quality while streamlining inspection procedures.
| Item | Specification |
|---|---|
| Model | IrisAnt T9D |
| Product Type | Inline 3D PCBA AOI System |
| Rail Type | Dual-Lane |
| Height Accuracy | ±2μm (with calibration tool) |
| Item | Specification |
|---|---|
| Camera | 26MP High-Speed Industrial Camera |
| 3D Technology | 4-Directional Scheimpflug Projection Units |
| FOV (Field of View) | 60mm × 60mm |
| Optical Resolution | 14μm |
| Inspection Speed | >10 cm²/s |
| Max Height Measurement Range | 25mm |
| Item | Specification |
|---|---|
| Rail Type | Dual-Lane (Lane 1 & 4 fixed, Lane 2 & 3 auto-adjustable) |
| Rail Height | 900±20mm |
| PCB Size (Dual-Lane Mode) | 50×50mm ~ 500×300mm (per lane) |
| PCB Thickness | 0.6mm ~ 5mm |
| Component Height Clearance | Top 50mm / Bottom 40mm |
| Minimum Component Size | 0603 (mm) / 0201 (inch) |
| Item | Specification |
|---|---|
| PCB Flow Direction | Left to Right, Right to Left (customizable) |
| W-Axis Rail Adjustment | Automatic Width Adjustment |
| Drive System & Positioning Accuracy | AC Servo Motors / ±0.01mm |
| Motherboard | ASUS B850-Plus |
| CPU | AMD Ryzen 9 7900X |
| Memory | Kingston DDR5 5600 64GB |
| Storage | WD 512GB SSD + WD 2TB HDD |
| Graphics Card | Nvidia 4070 12GB |
| Power Supply | AC 220V ±10%, 50/60Hz, 8.8KW |
| Air Supply | 4~6 Bar |
| Machine Dimensions (L×W×H) | 1290 × 1710 × 1990 mm (excluding signal tower) |
| Machine Weight | Approx. 1000kg |
| Category | Inspection Items |
|---|---|
| Component Inspection | Missing, tombstoning, side-standing, polarity, misalignment, wrong component, damage, flipped, lifted leads, foreign objects, floating, silk screen defects |
| Solder Joint Inspection | Solder wetting height, solder volume %, excessive solder, insufficient solder, bridging, lifted leads, surface scratches / contamination on gold fingers |
| Special Applications | Solder paste process, adhesive process, and post-wave-soldering PCBA inspection; 3D component height measurement, lifted lead / insufficient wetting height detection |
| Item | Specification |
|---|---|
| Inspection Algorithm | AI Embodied Spatial Intelligence, Feature Vector Analysis, OCV/OCR for Silk Screen |
| Programming Modes | AI Smart Programming, CAD Coordinate Import, Auto Component Library Indexing, Smart Panel Recognition |
| Marking Functions | PCB Full-Board Mark, Panel Mark, Bad Board Mark |
| Multi-Angle Inspection | 0~360°, Accuracy = 1 |
| Remote Control | Offline Programming, Remote Real-Time Debugging, Remote Viewing / Remote Operation Control |
| MES Integration | Open API for seamless MES/ERP connectivity |
| SPC Reporting | Automated Statistical Process Control & Data Reports |
The T9D’s dual-track configuration supports parallel inspection lanes, which can meet volume demands in OEM assembly or contract manufacturing environments. Its design allows integration with existing SMT lines and accommodates typical board dimensions and thicknesses common in the industry. This configuration may benefit distributors or procurement managers seeking AOI equipment that handles dual PCB processing for higher throughput.
AI-based programming reduces setup time, which can decrease line stoppages during product changeovers. Local data handling aligns with confidentiality requirements important for proprietary production processes. These features contribute to consistent inspection quality and may reduce labor inputs needed for programming and review. Such practical elements support efficient operation within medium to large-scale assembly operations.
Automotive Electronics, Medical Electronics, Aerospace & Defense (high-reliability requirements) — Consumer Electronics, Telecommunications Equipment, EMS Contract Manufacturers (high-density precision manufacturing, high-volume production)
— Shenzhen IrisAnt Intelligent Technology Co., Ltd —
