Description

Product Description

Functional Role in SMT Quality Control

The ST-2 digital AI SPI Inspection Machine is designed to support SMT production lines by providing accurate solder paste inspection. It targets manufacturing facilities requiring detailed defect identification, including offset, bridging, and insufficient solder. This system is appropriate for users needing inline and manual evaluation of printed solder paste quality to support production consistency and defect reduction.

Key Technical Features and Specifications

Equipped with a 20-megapixel industrial CCD camera and programmable Phase Modulation Profilometry (PSLM) technology, the ST-2 provides 3D imaging with a resolution down to 10 microns. Its standard color 2D imaging function assists in clear defect visualization without additional hardware. Additional features include fast Gerber programming, real-time PCB warpage compensation, and comprehensive statistical process control (SPC) tools, all aimed at ensuring accurate measurements and efficient line monitoring.

Practical Applications in Production Environments

This inspection system is applicable in SMT lines where precise solder paste measurements are essential, such as high-mix manufacturing or processes requiring fast programming changes. Its capabilities in adapting to warped PCBs and supporting both automatic and manual inspection modes make it suited for operational environments prioritizing accuracy and flexibility in solder paste quality control.

Product Advantages

Procurement-Relevant Design

The ST-2’s combination of programmable profilometry and a high-resolution CCD camera enables detailed 3D solder paste measurement without moving mechanical parts, which may reduce maintenance needs. The inclusion of standard color 2D imaging in the base system minimizes additional hardware requirements. Its compatibility with the SMEMA interface and support for Gerber program import allow integration with existing production lines, important factors for OEMs and distributors.

Operational Fit and Quality Control Support

With built-in SPC functions and real-time compensation for PCB warpage, the ST-2 enhances production monitoring capabilities. The system’s user interface and inspection modes support both automated inline checks and manual verification, providing flexibility for varying operational demands. These features contribute to maintaining consistent quality on SMT production lines where AI SPI is used, aligning with standard industry quality assurance practices.

1.1 Rainbow Ant ST-2 Series Product Description and Specifications:

Programmable Phase Modulation Profilometry (PSLM PMP) Technology: A patented invention by Rainbow Ant, its unique programmable structured grating allows for software-based setting of the grating period; eliminating mechanical drives and transmission components, significantly improving equipment accuracy and applicability, and avoiding mechanical wear and maintenance costs. It achieves 100% high-precision 3D measurement of precision-printed solder paste in SMT production lines.

Sitech's patented synchronous structured light technology solves the shadow effect interference in solder paste 3D inspection. Combined with an RG 2D light source, it perfectly handles high-contrast substrates, such as black substrates and ceramic substrates. Using red, blue, and green light, it can provide color 2D images.

High-Resolution Image Processing System: A 20-megapixel industrial CCD camera, paired with a high-end lens, supports rapid and stable inspection of 0201 solder paste. It offers multiple resolutions, including 10µm and 15µm, to meet the diverse product range and testing speed requirements of customers;

Fast Gerber import and programming software, enabling industry-leading programming in as little as 5 minutes; the manual teach function facilitates programming and testing even without Gerber data;

Real-time dynamic Z-axis contouring: PSLM's features provide real-time dynamic tracking of PCB warpage changes, perfectly solving warpage problems in flexible circuit boards and PCBs.

Powerful process statistical analysis (SPC) functions: Real-time SPC information display and a complete range of SPC tools allow users to monitor production issues in real time, reducing defects caused by poor solder paste printing. It provides operators with strong quality control support, offering users a clear overview;

Equipment repeatability accuracy << 10% (6 Sigma).

1.2 Equipment Hardware and Software Configuration

No.	Equipment System	Item	Specification Parameter
1	Vision System	Inspection Principle	Sinusoidal White Light Projection PMP Inspection
		Industrial CCD Camera	20 Megapixel
		Resolution	10 μm
		3D Projection Head	Projects periodic changing patterns; combined with CCD camera to obtain true 3D images. The 3D projection head is covered by a 10-year free replacement warranty.
		Black & White 2D Image	Standard configuration, convenient for operators to confirm defects
		Color 2D Image	Standard configuration, capable of generating color 2D images, more intuitive than black & white 2D images
		Real-time Z-axis Lifting	Standard configuration, provides hardware compensation for PCB warpage inspection
2	Mechanical System	Rail Mode	Single Rail
		PCB Inspection Area Range (L × W)	50×50 ~ 460×600 mm
		X-Y Mechanism	Inspection head moves along X-axis and Y-axis directions; PCB remains stationary during X/Y movement
		Fixed Side of Guide Rail	Front guide rail fixed
		Guide Rail Width Adjustment Method	Automatic and manual adjustment modes available
		PCB Positioning and Clamping Method	Edge positioning and clamping
		Guide Rail Height	900 ± 40 mm
		PCB Process Edge Clamping Width	3 mm
		PCB Transfer Direction	R→L or L→R; flow direction can be switched with one click in software, simple and convenient operation
3	Software System	System Software Operating Platform	Windows 10 64-bit Enterprise Edition
		Software Language	Chinese / English
		Programming Software	Gerber (RS-274X, RS274D), CAD
		Programming Time	< 5 minutes
		Program Fine-tuning Time	< 5 minutes
		Line Changeover Time	< 3 minutes
		Panelized PCB Program	Easy panelized PCB program creation (including positive and negative boards)
		Programming Mode & Data Input Type	SPI programs can use stencil files, Gerber (RS-274X, RS274D formats); manual window creation programming is also supported
		System Diagnosis	Standard configuration
		Ease of Operation	User-friendly interface with Windows-style design for convenient operation
		SPC Data Collection Analysis & Process Monitoring Software	Powerful SPC functions with comprehensive data collection, analysis, and management capabilities. Supports Production Trend, Xbar Chart, R Chart, Cp, Cpk and other related tests. Records quantified data of each solder joint on every PCB, including volume, area, height, offset, etc., and independently outputs spreadsheet-format reports. Supports defect cause statistical charts, full-board numerical images, normal distribution charts, individual component test data curve analysis, real-time defect image output, abnormal data/image storage and other functions.
		Network Technology Requirements	Supports TCP/IP protocol, real-time image transmission without affecting operation
4	Computer System	Computer Type	High-performance computer
		CPU	Intel i7
		Memory Capacity	24 GB Memory
		Hard Disk Capacity	1 TB HDD
		Operating System	Windows 10 64-bit Enterprise Edition
		Monitor	24" LCD Monitor
		Input Devices	Mouse, Keyboard
5	Machine Information	Equipment Dimensions	W1000 × D1150 × H1530 mm
		Air Supply Requirement	4–6 Bar
		Weight (KG)	1000 kg
		Power Supply	220V, 10A
		Power Consumption (Startup/Normal)	Startup: 2.5 kW / Normal Operation: 2 kW
		Working Air Pressure	5 L/min
		Floor Load Requirement	450 kg/m²
		Grounding Resistance Requirement	Grounding wire required
		Standard SMEMA Interface	Equipped, with OK/NG board output signals
		Safety Protection System	Equipped with comprehensive safety indicators and interlock system
6	Other Items	Barcode Scanning Function	Optional; can be equipped with external high-speed barcode scanner, supporting parent board and child board identification
		Automatic / Manual Inspection Function	Both modes available
		Technical Documentation	Complete technical, operation, and maintenance manuals (including electronic files) and software installation disk provided
		Software Upgrade Service	Permanent and free software upgrade service provided

Use Scenarios

SMT Production Line Quality Assurance
In procurement for SMT manufacturing facilities, the ST-2 serves as a key component for solder paste inspection. Its fast Gerber import and adjustable inspection areas make it suitable for various PCB sizes and production changes. Distributors and OEMs may consider this system to support clients seeking reliable inline solder paste defect detection in environments where ai spi is used in smt production lines, facilitating defect reduction and process control.

OEM and ODM Manufacturing Integration
For OEM and ODM suppliers, the ST-2 offers features conducive to integration within high-mix SMT assembly operations. The system’s programmable phase modulation profilometry combined with 3D and 2D imaging provides detailed surface defect analysis, supporting stringent quality requirements. Its compatibility with industry-standard interfaces and software flexibility aids in configuring the machine to specific manufacturing line needs.

FAQ

What production environments is the ST-2 digital AI SPI Inspection Machine designed for?
Our ST-2 is engineered specifically for SMT production lines, providing inline inspection of solder paste quality. It suits high-mix manufacturing environments requiring precise 3D measurements and real-time defect detection with our advanced AI SPI technology for consistent quality control.

Can the ST-2 machine be customized to fit specific PCB sizes or inspection needs?
Yes, we provide flexible programming with fast Gerber import and manual teaching to adapt to various PCB sizes from 50×50 mm up to 460×600 mm. The inspection area and guide rail adjustments support diverse production requirements tailored to your SMT line.

How do you ensure the ST-2 system maintains accuracy despite PCB warpage?
We utilize real-time Z-axis contouring with programmable phase modulation profilometry, which compensates for PCB warpage during inspection. This precise 3D measurement maintains defect detection accuracy without mechanical parts, ensuring stable long-term operation and minimal maintenance.

What are the installation and integration options for the ST-2 on existing SMT lines?
The ST-2 supports SMEMA-compatible interfaces for seamless integration with your SMT line automation. Its compact hardware design includes automatic or manual guide rail adjustments to fit different conveyor systems, simplifying installation and enabling quick setup for continuous production.