| optical system | |
|---|---|
| Optical camera | 20 million high-speed intelligent digital industrial camera (optional) |
| Resolution (FOV) | Standard 15 μ m/Pixel (corresponding FOV: 38mm × 30mm) 10/15/20 μ m/Pixel (optional) |
| optical lens | 20M pixel level telephoto lens, depth of field: 8mm-10mm |
| Light source system | High brightness RGB coaxial circular multi angle LED light source |
| hardware configuration | |
| operating system | Windows 10 Professional Edition |
| computer configuration | I7CPU, 12G GPU 3060 graphics card, 16G memory, 120G solid-state drive, 1TB mechanical hard drive |
| machine power supply | AC 220V ± 10%, frequency 50/60Hz, rated power 1.2KW |
| PCB flow direction | It can be set to left → right → left through the button |
| PCB clamp method | Double sided fixtures that automatically open or retract |
| Z-axis fixing method | 1 track fixed, 2 tracks adjustable automatically |
| Z-axis track adjustment method | Automatic width adjustment |
| orbital altitude | 900±25mm |
| atmospheric pressure | 0.4~0.8Map |
| Mechanical dimensions | 900mm × 950mm × 1600mm (L × W × H) height excluding alarm light |
| mechanical weight | 500kg |
| Select additional configurations | Offline programming software, external barcode gun MES traceability system interface open, maintenance station host |
| Testing PCB specifications | |
| size | 50 × 50mm~500 × 325mm (larger sizes can be customized according to customer requirements) |
| thickness | 0.3mm~6mm |
| Board weight | ≤3KG |
| Test Item | |
| solder paste printing | Existence, deviation, low tin content, high tin content, open circuit, pollution, continuous tin, etc |
| Defects in parts | Missing, offset, skewed, erected monument, side standing, flipped over, reversed polarity, wrong parts, damaged, multiple parts, etc |
| solder joint defect | Less tin, more tin, continuous tin, virtual soldering, multiple pieces, etc |
| Wave soldering detection | Insertion needle, Wuxi, less tin, more tin, virtual soldering, tin bead, tin hole, circuit breaker, multiple pieces, etc |
| Red adhesive board testing | Missing parts, offset, skewed, erected monument, side standing, flipping parts, polarity reversal, wrong parts, damage, glue overflow, multiple parts, etc |
