Deeply understand the principle of 3D AOI detection

In the field of modern electronic manufacturing, quality control is crucial. 3D AOI (Automated Optical Inspection) technology has become an important means of ensuring the quality of electronic products due to its high efficiency and detection capabilities. So, what is the detection principle of 3D AOI?

I. Basic Concepts of 3D AOI

3D AOI is a device that automatically detects electronic products such as PCB (Printed Circuit Board) through optical principles. It can quickly and accurately detect various defects on circuit boards, such as missing components, misalignment, polarity errors, poor soldering, etc., providing reliable quality assurance for the production of electronic products.

II. Detection principle of 3D AOI

Optical imaging system

3D AOI devices typically use high-resolution cameras and advanced optical lenses to capture multiple angles of the object being measured. By capturing images from different angles, the three-dimensional information of the object being measured can be obtained. This multi perspective imaging method can effectively overcome the limitations of traditional 2D AOI detection and more accurately detect the three-dimensional features such as height and shape of components.

Image analysis and processing

The collected images will be transmitted to the computer for image analysis and processing. Firstly, image preprocessing algorithms are used to denoise, enhance, and improve the quality of the image. Then, advanced image recognition algorithms are used to identify and locate the components in the image. At the same time, according to the preset inspection standards, the appearance, size, position, etc. of the components are inspected to determine whether there are defects.

3D measurement technology

3D AOI devices use various 3D measurement techniques, such as laser triangulation, structured light measurement, etc., to obtain height information of components. These technologies can accurately measure parameters such as height and thickness of components, thereby detecting three-dimensional defects such as welding defects and component protrusions.

Defect determination and classification

Based on the results of image analysis and 3D measurement, 3D AOI equipment can determine and classify the detected defects. For different types of defects, the equipment will provide corresponding alarm signals for operators to handle them in a timely manner. At the same time, the device can also generate detailed inspection reports to provide data support for quality control in the production process.

III. Advantages of 3D AOI

High precision detection

3D AOI can achieve three-dimensional detection of components with high detection accuracy and effectively detect small defects.

Efficient detection speed

Using advanced image acquisition and processing technology, 3D AOI can quickly detect circuit boards and improve production efficiency.

High degree of automation

3D AOI equipment can achieve fully automated detection, reducing manual intervention and minimizing human error.

Strong adaptability

It can adapt to different types of electronic products and production environments, and has a wide range of application prospects.

In short, 3D AOI technology is playing an increasingly important role in the field of electronic manufacturing with its advanced detection principles and advantages. With the continuous advancement of technology, the performance of 3D AOI equipment will continue to improve, providing more reliable guarantees for quality control of electronic products.